Compact integrated device packages

ABSTRACT

An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/378,587, entitled “COMPACT INTEGRATED DEVICE PACKAGES,” filed Aug.23, 2016, the entire disclosure of which is incorporated herein byreference for all purposes.

BACKGROUND Field

The field relates to compact integrated device packages, and, inparticular, to compact position sensor packages (e.g., magnetic sensors)sized and shaped to fit in a small space, such as within a body lumen, ahollow guidewire, a catheter lumen, minimally invasive surgical ordiagnostic instrument or a cavity of a human patient.

Description of the Related Art

Many medical devices utilize a catheter or other elongate structure toaccess internal organs of a human patient. For example, in varioustreatment and diagnostic procedures, a clinician can insert a guidewirethrough a body lumen of the patient and can deliver a distal end of theguidewire to a location within the patient. In cardiac treatmentprocedures, such as stent delivery, percutaneous transluminalangioplasty, cardiac mapping and ablation, cardiac pumping, or otherpercutaneous procedures, the clinician can use the Seldinger techniqueto access the patient's vascular system (e.g., the femoral artery) forinsertion of the guidewire. Once the guidewire is placed at the targetlocation, the clinician can insert a catheter system or other elongatestructure over the guidewire to guide the catheter system to thetreatment site.

Since the treatment or diagnosis site may be remote from the insertionsite, it can be challenging to monitor the location and/or orientationof the distal end of the guidewire and/or the working end of thecatheter system. The small diameter of the patient's blood vessels canlimit the maximum diameter of the catheter system, which in turn makesit challenging to incorporate sensor device dies and associatedpackaging structures. Moreover, since the sensor device dies and otherelectronics may dissipate power and may be used in the human body, itcan be important to provide a device package that does not generatesignificant heat, particularly as a point source, but rather spreads theheat over more area, to lower point temperatures. Similarly, the skilledartisan will recognize other applications in which very small tools ordevices should be located with precision.

Accordingly, there remains a continuing need for improved compactintegrated device packages for sensing the location of small tools ordevices, such as medical devices.

SUMMARY OF THE INVENTION

Specific implementations will now be described with reference to thefollowing drawings, which are provided by way of example, and notlimitation.

In one aspect, an integrated device package is disclosed. The packageincludes a package substrate, a first integrated device die mounted tothe substrate, a second integrated device die also mounted to thesubstrate, and a molding material. The first and second device dies arelongitudinally spaced from each other and the dies are angled relativeto one another about the longitudinal axis by a fixed non-parallelangle. The molding compound is disposed over the package substrate atleast partially between the dies to maintain the fixed non-parallelangle.

In some embodiments, the first and second device dies are sensor dies.The sensor dies can include magnetoresistance sensors, such as, forexample, anisotropic magnetoresistance (AMR) sensors, tunnelingmagnetoresistance (TMR) sensors, and giant magnetoresistance (GMR)sensors. The first integrated device die can be configured to sense aposition of the package along first and second orthogonal axes. Thesecond integrated device die can be configured to sense the position ofthe package along a third axis orthogonal to the first and second axes.A third integrated device die can be mounted to the package substrateand can be configured to process data, such as the transduced magneticflux intensity and position information by the first and secondintegrated device dies. The third integrated device die can be anamplifier, and/or analog-to-digital converter (ADC) or other signalconditioning circuitry.

In some embodiments, one or more of the first and second integrateddevice dies can be flip chip mounted, or wire bonded to the packagesubstrate.

In some embodiments, the integrated device package along thelongitudinal axis can be in a range of 3 mm to 15 mm. In someembodiments, the package can have a width along a transverse axis thatis perpendicular to the longitudinal axis, and the width can be in arange of 50 microns to 600 microns.

In some embodiments, the fixed non-parallel angle can be formed by atwisted section. The twisted section can be embedded in the moldingmaterial. The fixed non-parallel angle can be in a range of 89° to 91°.

In some embodiments, the molding material can be disposed over the firstand second integrated device dies.

In some embodiments, the package can further include a bracket assemblyextending along a longitudinal axis configured to provide stiffness forthe first and second integrated device dies. In some embodiments, thebracket assembly can comprise a plurality of brackets that are separatedfrom one another. In some embodiments, the bracket materials are madewith materials with low magnetic susceptibility.

In another aspect, another integrated device package is disclosed. Thepackage included a package substrate, a first integrated device diemounted to the substrate, a second integrated device die also mounted tothe substrate, and a molding material. The first and second device diesare longitudinally spaced from each other and the dies are angledrelative to one another about the longitudinal axis by a fixednon-parallel angle. The package has a width along a transverse axis thatis perpendicular to the longitudinal axis, the width being in a range of50 microns to 600 microns.

In some embodiments, the package can further include a molding materialthat fixes the fixed non-parallel angle.

In some embodiments, the first and second dies can be sensor dies. Thesensor dies can include magnetoresistance sensors, such as, for example,anisotropic magnetoresistance (AMR) sensors, tunneling magnetoresistance(TMR) sensors, and giant magnetoresistance (GMR) sensors.

In another aspect, a method for manufacturing an integrated devicepackage is disclosed. The method includes mounting a first integrateddie and a second integrated device die on a package substrate. The firstintegrated device die is longitudinally spaced from the secondintegrated device die. The method further includes deforming the packagesubstrate so as to make the first and second integrated device diesangled relative to one another about the longitudinal axis by a fixednon-parallel angle.

In some embodiments, the method can further include applying a moldingmaterial at least to a portion of the package substrate to maintain thefixed non-parallel angle by a molding material.

In some embodiments, the first and second integrated device diescomprise sensor dies.

In some embodiments, the deforming the package substrate can includeoffsetting the first and second dies in a transverse axis, twisting thepackage substrate, and/or adhering the package substrate to a bracketassembly.

In another aspect, another integrated device package is disclosed. Thepackage included an elongate bracket extending along a longitudinal axisthat has a first support and second support surfaces. The surfaces areplaced at a fixed non-parallel angle about the longitudinal axisrelative to the first support surface. The package also includes apackage substrate comprising a first portion and a second portion. Thefirst portion is mechanically connected to the first support surface.The second portion is mechanically connected to the second supportsurface. The package also includes a first integrated device die and asecond integrated device die that are mounted to the first portion andthe second portion respectively. The package transverse dimension isless than 600 microns, where the transverse dimension is a dimensiontransverse to the longitudinal axis.

In some embodiments, the first portion and the second portion form partof a single package and/or are defined by separate package substrates.

In some embodiments, the first integrated device die can be spaced fromthe second integrated device die along the longitudinal axis.

In some embodiments, the package substrate can comprise one or morebends. The bends can comprise a twisted section. The twisted section isplaced between the first and second portions so as to position the firstand second portions at the fixed non- parallel angle relative to oneanother.

In some embodiments, the first and second integrated device dies aresensor dies. The sensor dies may be magnetoresistance sensors. Forexamples, the magnetoresistance sensors may be anisotropicmagnetoresistance (AMR) sensors, tunneling magnetoresistance (TMR)sensors, and giant magnetoresistance (GMR) sensors. The first integrateddevice die can be configured to sense a position of the package alongfirst and second orthogonal axes and the second integrated device diecan be configured to sense the position of the package along a thirdaxis orthogonal to the first and second axes.

In some embodiments, the package can also include a third integrateddevice die mounted to the package substrate that can be configured toprocess position data transduced by the first and second integrateddevice dies.

In some embodiments, the bracket can include a transverse portion placedbetween and connecting the first and second support surfaces.

In some embodiments, one or more of the first and second integrateddevice dies can be flip chip mounted to and/or wire bonded to thepackage substrate.

In some embodiments, a length of the bracket along the longitudinal axiscan be in a range of 1 mm to 8 mm, 1 mm to 6 mm, 2 mm to 6 mm, or 3 mmto 5 mm.

In some embodiments, the package can have a width along a transverseaxis that is perpendicular to the longitudinal axis, the width being ina range of 50 microns to 600 microns, 100 microns to 450 microns, or 100microns to 400 microns.

In some embodiments, the fixed non-parallel angle is in a range of 89°to 91° or 89.5° to 90.5°.

In some embodiments, the package substrate can be adhered to thebracket. In some embodiments, the package substrate can extend beyondthe bracket along the longitudinal axis.

In some embodiments, the bracket can be a non-magnetic material. In someembodiments, the bracket can be copper.

In some embodiments, the package can also include a package body inwhich the first and second integrated device dies are disposed.

In some embodiments, the elongate bracket can comprise a first bracketcomponent having the first support surface and a second bracketcomponent having the second support surface, where the first and secondbracket components are separated by the package substrate along alongitudinal axis.

In some embodiments, the package can further comprise a molding materialthat fixes the fixed non-parallel angle.

In another aspect, another integrated package is disclosed. Theintegrated package includes a package substrate, a first magnetic sensordie mounted to the package substrate, and a second magnetic sensor diemounted to the package substrate. The first magnetic sensor die isspaced from the second magnetic sensor die along a longitudinal axis.The first and second magnetic sensor dies are angled relative to oneanother about the longitudinal axis by a fixed non-parallel angle. Theintegrated device package has a width along a transverse axis that isperpendicular to the longitudinal axis. The width can be in a range of50 microns to 600 microns.

In some embodiments, the package can also include an elongate bracketextending along the longitudinal axis. The elongate bracket can includea first support surface and a second support surface disposed at thefixed non-parallel angle about the longitudinal axis relative to thefirst support surface.

In some embodiments, the elongate bracket can include a first bracketcomponent having the first support surface and a second bracketcomponent having the second support surface.

In some embodiments, the package substrate can include one or aplurality of package substrates.

In some embodiments, the package can also include a molding materialthat fixes the fixed non-parallel angle.

In some aspects, a medical device is disclosed. The medical deviceincludes an elongate body that has a proximal portion and a distalportion spaced from the proximal portion along a longitudinal axis. Themedical device also includes an integrated device package coupled withthe elongate body. The integrated device package includes a firstintegrated device die and a second integrated device die spaced from thefirst integrated device die along the longitudinal axis. The integrateddevice package has a width along a transverse axis that is perpendicularto the longitudinal axis. The width being in a range of 50 microns to600 microns. The first and second integrated device dies are angledrelative to one another about the longitudinal axis by a fixednon-parallel angle.

In some embodiments, the integrated device package has a length alongthe longitudinal axis in a range of 1 mm to 8 mm.

In some embodiments, the elongate body can include a catheter, and theintegrated device package can be placed in a lumen of the catheter.

In some embodiments, the elongate body can include a guidewire, and theintegrated device package can be coupled with the guidewire.

In some embodiments, the medical device can also include a cableextending proximally from the integrated device package along theelongate body, and the cable can be electrically connected to leads ofthe integrated device package.

In some embodiments, the medical device can also include a controller inelectrical communication with the integrated device package. Theintegrated device package can be configured to transmit a signal to thecontroller indicative of a position of the integrated device package.

In some embodiments, the controller can include processing electronicsconfigured to analyze the signal to determine the position of theintegrated device package.

In some embodiments, the controller can be configured to provide powerand ground to the electronic device package by way of one or morecables.

In some embodiments, the first and second integrated device dies caninclude anisotropic magnetoresistance (AMR) sensor dies.

In some embodiments, the medical device can also include a magneticgenerator that can be configured to generate a magnetic field to besensed by the first and second integrated device dies.

In some embodiments, the magnetic generator can include a plurality ofmagnetic generators spaced from one another. Each magnetic generator ofthe plurality of magnetic generators can be configured to generate therespective magnetic field at different frequencies.

In some embodiments, the first and second integrated device dies can beconfigured to transduce the magnetic field generated by the magneticgenerator into respective position signals representative of therespective positions of the first and second integrated device dies. Thecontroller can include processing electronics that can be configured todetermine the position of the integrated device package based on acomparison of the respective position signals.

In some embodiments, the medical device can also include a moldingmaterial that fixes the fixed non-parallel angle.

In another aspect, another integrated device package is disclosed. Theintegrated device package includes an elongate bracket extending along alongitudinal axis, a package substrate that has a first portion and asecond portion, a first integrated device die mounted to the firstportion of the package substrate, and a second integrated device diemounted to the second portion of the package substrate. The elongatebracket includes a first bracket component having a first supportsurface and a second bracket component having a second support surface.The second support surface is placed at a fixed non-parallel angle aboutthe longitudinal axis relative to the first support surface.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will now be described with reference to the followingdrawings, which are provided by way of example, and not limitation.

FIG. 1 is a schematic system diagram of a device comprising an elongatebody and compact integrated device packages coupled to the elongatebody.

FIG. 2 is a schematic system diagram of the device during use in aprocedure.

FIG. 3 is a schematic front perspective view of an integrated devicepackage having a bracket assembly coupled with the elongate body anddisposed within a lumen in accordance with an embodiment.

FIG. 4 is a schematic rear perspective view of the integrated devicepackage of FIG. 3 disposed within the lumen.

FIG. 5 is a schematic front perspective view of the integrated devicepackage of FIG. 3 outside of the lumen.

FIG. 6 is a schematic end view of the integrated device package disposedwithin the lumen, as viewed along the longitudinal axis of the package.

FIG. 7 is a schematic perspective exploded view of the integrated devicepackage of FIG. 5.

FIG. 8 is schematic front view of the integrated device package having abracket assembly, in accordance with another embodiment.

FIG. 9 is schematic backside view of the integrated device package ofFIG. 8.

FIG. 10 is a top perspective view of the integrated device packagescoupled with a frame during a manufacturing process.

FIG. 11 is an enlarged view of an exemplary integrated device package ofFIG. 10 shown with portions of the frame.

FIG. 12 is a schematic front perspective view of the integrated devicepackage including a third integrated device die and at least partiallysurrounded by a molding material in accordance with another embodiment.

FIG. 13 is a schematic end view of the integrated device package, asviewed along the longitudinal axis of the package, disposed within themolding material.

FIG. 14 is a schematic top-down plan view of the package showing thedies mounted in a common plane on a substrate, in a stage ofmanufacturing prior to twisting the substrate.

FIG. 15 is a schematic end view of the device package of FIG. 14, asviewed along the longitudinal axis of the package.

FIG. 16 is a schematic front perspective view of an integrated devicepackage, according to another embodiment.

FIG. 17 is a schematic back perspective view of the integrated devicepackage of FIG. 16.

FIG. 18 is a schematic end view of the integrated device package ofFIGS. 16 and 17, as viewed along the longitudinal axis of the package.

FIG. 19 is a top perspective view of the integrated device packages ofFIGS. 16 and 17 coupled with a frame during a manufacturing processprior to forming a twisted section.

DETAILED DESCRIPTION

Various embodiments disclosed herein relate to integrated devicepackages that have a compact or low profile and that may be used tosense the location of small devices. For example, various packagesdisclosed herein can be configured for use in devices that are insertedinto a body lumen or body cavity of a human patient. In someembodiments, the integrated device packages are configured to be coupledto a guidewire that is for insertion into a body lumen or body cavity ofa human patient. The embodiments disclosed herein may be particularlybeneficial for use with systems that are used at a location remote fromthe clinician and/or access site, e.g., when the treatment or diagnosislocation is not easily visible from outside the body. For example, thepackages disclosed herein can be used in any suitable type of medicaltreatment or diagnostic procedure, including, e.g., cardiaccatheter-based treatments, pill-based diagnostic and treatmenttechniques, endoscopy treatments, urinary catheters and endoscopes,ultrasonic imaging catheters, ear-nose-and-throat based catheters,gastroenterology treatments, colonoscopy treatments, etc. With respectto cardiac treatments, the packages disclosed herein can be used incardiac diagnostic catheters, die delivery catheters, catheter-basedpumps, optical coherence tomography (OCT) catheters, valve deliverycatheters, intracardiac echocardiography (ICE) catheters,transesophageal echocardiography (TEE) catheter, diagnostic catheters,PICC lines or any other suitable device. In some embodiments, thepackages disclosed herein can be coupled with the guidewire, in additionto, or as an alternative to, coupling the package to the catheter.

In various medical procedures having treatment locations remote from theclinician and/or access site, it can be important to monitor theposition and/or the orientation of a working end of the medical device,e.g., the portion of the medical device that interacts with thetreatment or diagnosis region. However, in many situations, it can bechallenging to package sensors in a sufficiently compact profile toenable insertion into the anatomy. Similarly, in other applicationscompact location sensors are desirably associated with small tools ordevices, particularly to aid precise positioning of such tools ordevices in three dimensions.

To package the sensors provided on the working end such that the sensorscan be inserted into the anatomy, in some embodiments, the working endcan be included on an elongate bracket assembly. The elongate bracketassembly can be comprised of one or more brackets. The brackets may beseparated along the longitudinal axis. Accordingly, various embodimentsherein provide an elongate bracket assembly extending along alongitudinal axis of the tool or device. The elongate bracket assemblycan include a first support surface and a second support surfacedisposed at a fixed non-parallel angle about the longitudinal axisrelative to the first support surface. The fixed non-parallel angle canbe about 90° in some arrangements, e.g., in a range from 89° to 91°, orin a range from 89.5° to 90.5°. A package substrate can comprise a firstportion and a second portion, the first portion mechanically connectedto the first support surface and the second portion mechanicallyconnected to the second support surface. A first integrated device diecan be mounted to the first portion of the package substrate. A secondintegrated device die can be mounted to the second portion of thepackage substrate. Thus, the first and second device dies can bedisposed relative to one another at the fixed non-parallel angle.

In some arrangements, each of the first and second device dies comprisesa magnetic sensor, such as an anisotropic magnetoresistance (AMR)sensor, a tunneling magnetoresistance (TMR) sensor, or a giantmagnetoresistance (GMR) sensor. In various embodiments, the first diecan measure the position of the package along two coordinates, and thesecond device die can measure the position of the package along a thirdcoordinate. Angling the device dies relative to one another by way ofdeforming the package substrate can beneficially enablethree-dimensional position detection of the package within the anatomy.For example, the two dies can be angled approximately perpendicular toone another to enable position sensing along three orthogonal axes. Thesensor packages disclosed herein can be used in various applications,including medical devices or other technologies in which sensors areprovided in small spaces. For example, in medical deviceimplementations, the sensors can be used to sense variouscharacteristics of the human body. Although the embodiments disclosedherein relate to position sensing, it should be appreciated that othertypes of sensors may be used, such as sensors that detect velocity,acceleration (e.g., accelerometers), orientation (e.g., gyroscopes),temperature, pressure, pH, etc.

FIG. 1 is a schematic system diagram of a device 1, such as a medicaldevice, comprising an elongate body 2 having a proximal portion 3 and adistal portion 4 spaced from the proximal portion 3 along a longitudinalaxis x. The longitudinal axis x may be defined in local coordinates ofthe elongate body 2, and may not necessarily correspond to fixedCartesian coordinates. The elongate body 2 can comprise a medicaldevice, such as a catheter or a guidewire. The device 1 can comprise oneor a plurality of compact integrated device packages 10, such aspackages 10A, 10B, 10C, 10D, coupled with the elongate body 2. Thepackages 10 can be disposed in a lumen of the elongate body 2, or can beattached to an outside surface of the elongate body 2. In someembodiments, only a single device package 10 may be coupled with theelongate body 2. In the example of a surgically or percutaneouslyimplemented medical device, the device package 10 can be configured toprovide the clinician with an indication of the position of the package10 (and hence the portion of the elongate body 2 to which the package 10is coupled) within the patient's anatomy. The indicated position can beprovided relative to a three-dimensional coordinate system in someembodiments, so that the clinician can beneficially determine theprecise location of the working end and/or a path of the elongate body 2within the body.

In other embodiments, a plurality of device packages 10 may be disposedalong a length of the elongate body 2. Utilizing a plurality of packages10 (such as packages 10A-10D) may advantageously provide the clinicianwith position information of different portions of the elongate body 2.Information about the position of multiple portions of the elongate body2 can assist the clinician in positioning the working end of theelongate body 2 relative to the anatomy. For example, in medical deviceapplications, multiple packages 10 can be used to guide differentbranches of the elongate body 10 into lateral vessels (such as Y-shapedbranches), and/or to position the elongate body 10 (or portions thereof)across a cardiac valve.

FIG. 2 is a schematic system diagram of the device 1 during use in aprocedure, according to various embodiments. The device 1 can includethe elongate body 2 shown in FIG. 1, with only a single integrateddevice package 10 coupled with the elongate body 2. It should beappreciated that multiple packages 10 can also be used in connectionwith FIG. 2. As shown in FIG. 2, the elongate body 2 can be disposedwithin an object 5 during a procedure, such as within a body of a humanpatient during a treatment or diagnostic procedure. During theprocedure, the proximal portion 3 can be disposed at or near an accesssite 23 (such as the femoral artery for cardiac catheterizationprocedures). One or more conduits 25 can connect the proximal portion 3of the elongate body 2 with a console 9. The one or more conduits 25 maycomprise one or more fluid conduits configured to deliver fluid toand/or remove fluid from the elongate body 2. The one or more conduits25 may also include one or more electrical cables to provide electricalcommunication between the console 9 and various electrical andelectronic components of the elongate body 2 (including, e.g., thepackage 10).

For example, the console 9 can comprise a controller that can providepower and/or ground to the device package 10 by way of the one or moreconduits 25 (e.g., electrical cables). The controller can compriseprocessing electronics configured to control the operation of the device1. For example, the processing electronics can be programmed by way ofsoftware to implement instructions that operate the device 1. Theconsole 9 may also include various fluid reservoirs, pumps, sensors, andother devices used in connection with the operation of the device 1. Theconsole 9 can transmit signals to and receive signals from the package10 at the working end of the device 1. In various embodiments, theconsole 9 can comprise a user interface (such as a display ortouch-screen display, a keypad, etc.) that informs the clinician aboutthe status of the procedure and/or the location of the working end ofthe device 1. The clinician can input instructions to the console 9 byway of the user interface to select various settings and/or operationalmodes of the device 1 during and/or before use. In some embodiments, theconsole 9 can be connected to an external processing device (e.g., acomputer) that can, for example, act as the user interface and/oranalyze operation data. In some embodiments, the console 9 can receivethe signals from the package 10, and can provide feedback to the package10 with further instructions based on the received signals.

In some embodiments, as explained herein, the package 10 can comprise aposition sensor package configured to determine an approximate positionof the package 10, and therefore the portion of the elongate body 2 towhich the package is connected. In some embodiments, for example, thepackage 10 can comprise a magnetic sensor package, and particularly amagnetoresistance sensor package, e.g., an anisotropic magnetoresistance(AMR) sensor package, a tunneling magnetoresistance (TMR) package, or agiant magnetoresistance (GMR) package. For example, AMR packages, suchas the packages 10 disclosed herein, can comprise a plurality of AMRsensor dies having an anisotropic material in which electricalresistance depends on an angle between the direction of electricalcurrent and the direction of the magnetic fields sensed by theanisotropic material. In some arrangements, for example, the resistancemay be maximized when the direction of current is parallel to themagnetic field, and the resistance may be reduced at other angles.

As shown in FIG. 2, a magnetic generator 7 may be provided with thedevice 1 so as to generate a magnetic field 8 to be transduced by thepackage 10. The magnetic generator 7 may comprise one or a plurality ofmagnetic generators, each of which may comprise one or a plurality ofcoiled wires. In the illustrated embodiment, for example, the magneticgenerator 7 comprises a plurality of magnetic generators 7A, 7B, 7Cspaced from one another by predetermined spacings. Each magneticgenerator 7A-7C of the plurality of magnetic generators can beconfigured to generate a respective magnetic field 8A-8C at differentfrequencies. In some arrangements, the console 9 can control theoperation of the magnetic generator 7, while in other embodiments, themagnetic generator 7 may be controlled separately from the console 9 towhich the elongate body 2 is connected. The generated magnetic fields8A-8C may be sufficiently strong so as to penetrate the object 5 and tobe sensed by the package 10. For example, in some embodiments, theobject 5 (e.g., human patient) may lie on a table, with the magneticgenerators 7A-7C disposed under the table and object 5.

In various embodiments, the package 10 can be configured to detect thegenerated magnetic fields 8A-8C. The integrated device package 10 can beconfigured to transmit a signal to the controller of the console 9 thatis indicative of a position of the integrated device package 10. Thepackage 10 can comprise one or a plurality of integrated device diesthat can detect the components of the magnetic fields 8A-8C in threedimensions. The signal can be transmitted to the controller by way ofthe conduit(s) 25. The controller can include processing electronicsconfigured to analyze the signal to determine the position of theintegrated device package 10. For example, the controller can beconfigured to compare the signal transmitted by the package 10 with thedata about the fields 8A-8C generated by the magnetic generators 7A-7C,and/or to compare the signals transmitted from each die of the package10 with one another. In some embodiments, the magnetic fields 8A-8C maycomprise different frequencies that are detectable by the processingelectronics. The controller can therefore associate each of the fields8A-8C detected by the package 10 with an associated magnetic generator7A-7C, based at least in part on the associated frequency of the fields8A-8C. The known positions of the magnetic generators 7A-7C in a globalset of Cartesian coordinates (e.g., X, Y, Z) set by the console 9 can beused to triangulate the position, rotation, and/or orientation of thepackage 10 in and about three dimensions. The processing electronics ofthe controller can therefore be configured to determine the position ofthe integrated device package 10 based on a comparison of the respectiveposition signals of each sensor die in the package 10. In somearrangements, the differential output signals from the dies may comprisea pair of twisted wires or a pair of wires spaced closely to oneanother. Such an arrangement may beneficially reduce any inductance fromthe magnetic generator 7 in the differential output signal.

FIG. 3 is a schematic front perspective view of the integrated devicepackage 10 coupled with the elongate body 2, according to variousembodiments. FIG. 4 is a schematic rear perspective view of the package10 of FIG. 3. In the embodiment of FIGS. 3 and 4, the package 10 isshown inside a lumen 11 of the elongate body 2 (which may have a singlelumen or multiple different lumens therein). In some embodiments, thepackage 10 is disposed inside of a lumen of a catheter. In otherembodiments, however, the package 10 can be disposed on an outer surfaceof the elongate body 2, or otherwise coupled with the elongate body 2,or could be employed independently of any lumens. The elongate body 2 asshown in some Figures has a cylindrical shape but the elongate body 2may have any suitable shape for receiving or coupling to the package 10.

FIG. 5 is a schematic front perspective view of the integrated devicepackage 10. FIG. 6 is a schematic end view of the integrated devicepackage 10, as viewed along the longitudinal axis of the package 10,with the package 10 shown disposed within the lumen 11 of the elongatebody 2. FIG. 7 is a schematic perspective, exploded view of theintegrated device package 10. As shown in FIGS. 3-7, the package 10 cancomprise an elongate bracket assembly 14 extending along a longitudinalaxis x, the elongate bracket assembly 14 comprising a first supportsurface 19 and a second support surface 20 disposed at a fixednon-parallel angle about the longitudinal axis x relative to the firstsupport surface 19. The longitudinal axis x may be defined in localcoordinates of the integrated device package 10, and may not necessarilycorrespond to fixed Cartesian coordinates. For example, the first andsecond support surfaces 19, 20 can be disposed generally perpendicularto one another about the longitudinal axis x. A package substrate 15 caninclude a first portion 26 and a second portion 27, the first portion 26mechanically connected to the first support surface 19 and the secondportion 27 mechanically connected to the second support surface 20. Forexample, the first and second portions 26, 27 can be adhered to thefirst and second support surfaces 19, 20 of the bracket assembly 14 byway of an adhesive.

A first integrated device die 13 can be mounted to the first portion 26of the package substrate 15. A second integrated device die 12 can bemounted to the second portion 27 of the package substrate 15. Forexample, the first and second device dies 13, 12 can be attached to thesubstrate 15 using a suitable die attach material. As shown in FIG. 3-7,the first and second device dies 13, 12 can be spaced from one anotheralong the longitudinal axis x of the package 10. The first and seconddevice dies 13, 12 can comprise any suitable type of device die, such asa motion or position sensor die, a processor die, amicroelectromechanical systems (MEMS) die, etc. In the illustratedembodiment, the first and second dies 13, 12 comprise magnetic sensordies, e.g., magnetoresistance sensors such as AMR, GMR, or TMR sensordies, that can serve as position and/or rotation sensors in combinationwith known external magnetic field source(s). For example, the firstintegrated device die 13 can be configured to sense a position and/ororientation of the package 10 along and about first and secondorthogonal axes (e.g., X and Y axes), and the second integrated devicedie 12 can be configured to sense the position and/or orientation of thepackage 10 along and about a third axis (e.g., Z axis) orthogonal to thefirst and second axes, or vice versa. For example, as shown in FIG. 7,the first die 13 can have first and second sensing regions 31 a, 31 bthat are configured to sense the position and orientation of the package10 along and about X and Y axes, respectively. The second die 12 canhave a third sensing region 31 c that is configured to sense theposition and orientation of the package 10 along and about the Z axis.The sensing regions 31 a-31 c may be sensitive to magnetic fields, asdescribed above, and can estimate the position and/or orientation of thedies 13, 12 based on the detected magnetic field. In some embodiments,the sensing regions 31 a-31 c may be separated within the package 10 byvarious non-magnetic materials. For example, the portions of the dies13, 12, and/or the portions of the substrate 15 (such as the twistedsection 17), that intervene between the regions 31 a-31 c may benon-magnetic. Similarly, the bracket assembly 14 may be non-magnetic.While FIGS. 3, 5, and 7 show the die 13 having one sensing region 31 a,and the die 12 having two sensing regions 31 b, 31 c, the dies 13, 12can have any suitable number of regions. Further, the die 13 as shown inFIGS. 3, 5, and 7 includes the sensing region 31 c at a distal portionof the die 13, but the region 31 c may instead be disposed nearer aproximal portion of the die 13 (e.g., the die 13 could be rotated by180° about an axis perpendicular to the major surface of the die 13).Such an alternative arrangement may position contact pads of the die 13nearer the proximal portion of the die 13 may reduce substrate costs andnoise coupling into the sensing region 31 c.

In embodiments that utilize AMR sensor dies for the first and seconddevice dies 13, 12, it can be important to dispose the dies 13, 12 at afixed angle relative to one another, so that the active surfaces of thedies 13, 12 are at a known angle. By angling the dies 13, 12 relative toone another about the longitudinal axis x of the package 10, thethree-dimensional position of the package 10 can be calculated. Forexample, in the illustrated embodiment, the dies 13, 12 can be angledrelative to one another about the longitudinal axis x by a fixednon-parallel angle of about 90°, e.g., in a range of 89° to 91°, or in arange of 89.5° to 90.5°. However, it should be understood that invarious other embodiments the fixed non-parallel angle can be any angleso long as the AMR sensor dies detect enough difference in magneticfield to accurately calculate the three-dimensional position of thepackage 10.

To enable the precise relative angular orientation of the dies 13, 12,in some embodiments, the bracket assembly 14 can provide a stiff supportstructure to support the integrated device dies 13, 12. For example, thebracket assembly 14 can include a transverse portion 18 disposed betweenand connecting the first and second support surfaces 19, 20. Thetransverse portion 18 can act as a transition to precisely orient thefirst and second support surfaces 19, 20 by the fixed non-parallelangle. However, in some embodiments, the transverse portion 18 may beeliminated. In such embodiments that do not comprise the transverseportion 18, the bracket assembly 14 can comprise multiple bracketcomponents that are spaced and/or separated, for example, brackets 14 a,14 b shown in FIG. 8, as explained below. The bracket assembly 14 cancomprise a non-magnetic material in some embodiments, such as copper oraluminum. The bracket assembly 14 can be shaped from a single piece ofmaterial in some embodiments. In some other embodiments, multiple piecescan be connected to define the bracket assembly 14. The angled surfaces19, 20 can be precisely positioned, which can advantageously lower theresolution and increase the dynamic range of the sensor dies.

In some embodiments, the package substrate 15 can comprise a singlepackage substrate sufficiently flexible to comprise one or more bends.For example, in the illustrated embodiment, the package substrate 15 cancomprise one or more bends that enable the substrate 15 to conform tothe angled surfaces 19, 20 of the bracket assembly. As shown in FIGS. 3,5, and 7, for example, the substrate 15 can comprise a twisted section17. The twisted section 17 can be disposed between the first portion 26and the second portion 27 of the substrate 15 so as to position thefirst and second portions 26, 27 at the fixed non-parallel anglerelative to one another. It should be understood that, for someembodiments, the twisted section 17 may not be fixed in all directionsas long as the relative angle of the portions 26, 27 is fixed. Forexample, in some embodiments the first and second portions 26, 27 may beallowed to bend relative to one another about an x-z line or about anx-y line. The package substrate 15 can comprise a laminate substrate insome embodiments, with conductors embedded in an insulator. In someembodiments, the package substrate 15 can comprise a plurality ofsubstrates. For example, in such embodiments, the first and secondportions 26, 27 can be defined by separate substrates that may or maynot be connected to one another. The substrate 15 can be sufficientlyflexible such that the bend(s) (e.g., the twisted section 17) can beformed by a user or a machine applying a twisting force to the substrate15 about the longitudinal axis x without breaking and/or shortinginternal conductors. When assembled, the portions of the substrate 15that are not attached to the bracket assembly 14 (including, e.g., thetwisted portion 17) may remain flexible so as to be compressed and/orbent to accommodate different package geometries. In variousembodiments, the package substrate 15 can comprise a flexible insulator(e.g., polyimide) with embedded metal traces that provide electricalconnectivity through the substrate 15.

The package substrate 15 can comprise a plurality of conductive leads 16configured to provide electrical communication with a cable or otherinterconnect that connects with the console 9. In the illustratedembodiment, for example, there may be eight leads 16 configured toprovide connections for ground, power, and six signal lines. The sixsignal lines may comprise two terminals for each position signal to betransduced. For example, in the three-dimensional position sensorpackage 10 shown herein, two leads 16 may be provided for each Cartesiancoordinate (X, Y, Z). The two device dies 13, 12 may be electricallyconnected to one another through the substrate 15 in some embodiments.In other embodiments, the dies 13, 12 are not electrically connected toone another. In the illustrated embodiment, the conductive leads 16 maybe disposed proximal the dies 13, 12.

The integrated device dies 13, 12 may be mechanically and electricallyconnected to the substrate 15 in any suitable manner. For example, asshown in FIG. 6, the dies 13, 12 may be flip chip mounted to thesubstrate 15 by way of a plurality of solder balls 21. In someembodiments, the dies 13, 12 can be connected to the substrate 15 by wayof anisotropic conductive film, non-conductive paste, or athermocompression bond. In some embodiments, the dies 13, 12 can be wirebonded to the substrate 15 using conductive bonding wires. The substrate15 may be densely patterned in various arrangements, and can be bendableso as to form the twisted section 17. In some embodiments, the package10 may be disposed in a package housing or package body (not shown). Forexample, the package 10 illustrated in FIGS. 3-7 may be entirely orpartially encapsulated with a molding material 32 in some embodiments soas to protect the components from fluids and other materials during useand/or to fix the fixed non-parallel angle. The molding material 32 canbe any suitable material, e.g., thermosetting or ultraviolet (UV) curedepoxy, injection molded compound, transfer molded compound, glob top,laminated layers, gravity poured epoxies, melted sheets, encapsulant,plastic, etc.

In some procedures, the elongate body 2 may be guided through variouscurves and bends, such as through parts of the anatomy for medicaldiagnostic or treatment procedures. It can be important to ensure thatthe elongate body 2 is sufficiently flexible so as to traverse suchnon-linear paths. Accordingly, it can be important to provide a package10 that minimizes a length L of the bracket assembly 14, since thebracket assembly 14 may drive the overall stiffness of the package 10(see FIG. 7). In some embodiments, length L of the bracket assembly 14along the longitudinal axis x can be no more than 8 mm, e.g., in a rangeof 1 mm to 8 mm, in a range of 1 mm to 6 mm, in a range of 2 mm to 6 mm,or in a range of 3 mm to 5 mm. Dimensioning the bracket assembly 14 andthe package 10 to have a short stiff length can enable the elongate body2 to traverse curved pathways in the body.

The elongate body 2 has a diameter d for receiving or coupling thepackage 10 within the body 2, as viewed along the longitudinal axis x ofthe package 10 (see FIG. 6). The diameter d can be in a range of 0.6millimeters to 2.5 millimeters, in a range of 1 millimeter to 2.5millimeters, or in a range of 1 millimeter to 2 millimeters.

Moreover, it can be important to provide the package 10 with a widththat is small enough to be inserted into small spaces for theapplication of interest, such as a body lumen or cavity of the patient.For example, the molding material 32 that surrounds the package 10 canhave a width W along a transverse axis that is perpendicular to thelongitudinal axis x. The width W defines the largest transversedimension of the package. In case of the embodiment illustrated in FIG.6, the width W corresponds to the diameter of the molding material 32because the molding material 32 has a cylindrical shape. The width W canbe in a range of 300 microns to 800 microns, in a range of 400 micronsto 800 microns, or in a range of 400 microns to 600 microns (see FIG.6). The width W can represent the largest extent of the package 10 alongthe direction transverse to the longitudinal axis x. The diameter d ofthe elongate body 2 may determine the maximum width W of the moldingmaterial 32 for the package 10.

In some embodiments, additional integrated device dies and electricalcomponents may be provided in the package 10. For example, in someembodiments, a third integrated device die (such as a processor die, anamplifier, a filter, an analog-to-digital converter (ADC), etc.) can bemounted to the substrate 15 along the first or second portions 26, 27(see, e.g., the die 28 of FIG. 12). The third integrated device die canprocess signals transmitted from the first and second dies 13, 12. Forexample, in some embodiments, the third die 28 can provide variouspre-processing capabilities (e.g., analog to digital conversion and/orsignal amplification) in the package 10, which can increase the accuracyof the measurements. Positioning the third die 28 (see the die 28 ofFIG. 12) within the package 10 near the dies 13, 12 can beneficiallyreduce signal losses caused by directing the signals to the console 9without any pre-processing. The three device dies 13, 12, 28 may beelectrically connected to one another through traces embedded in thesubstrate 15.

In some embodiments, the substrate 15 can extend beyond the bracketassembly 14 along the longitudinal axis x. For example, as shown inFIGS. 3 and 5, the substrate 15 may extend beyond the bracket assembly14 so as to provide electrical communication between electrical cablesand the leads 16. In some embodiments, the package substrate 15 canextend within the elongate body 2 for a substantial distance. Forexample, the package substrate 15 can extend proximally from the package10 to the proximal portion 3 of the device 1. In other embodiments, thepackage substrate 15 can extend at least halfway from the package 10 tothe proximal portion 3. In still other embodiments, the packagesubstrate 15 can extend at least a third or at least a quarter of thedistance from the package 10 to the proximal portion 3.

In such arrangements, the extended length of the package substrate 15can enable the integration of additional integrated device dies andelectrical components into the device 1. For example, in someembodiments, it may be preferable to position additional device dies(such as the third die referenced above) at a distance from the package10 so as to reduce the amount of heat generated by the package 10. Insome cases, if too many electrical components are provided in a smallspace, the increased temperature due to power dissipation can beundesirable for the application of interest, such as use in a patient'sbody for medical diagnostic or treatment applications. Spreading theadditional device dies (such as processing dies) along the length of thedevice 1 and connected with an extended length substrate 15 canbeneficially disperse the generated heat so that the temperature in aparticular location does not appreciably increase. Furthermore, eventhough the additional dies may not be disposed within the package 10,the additional dies may still be nearer the package 10 than theyotherwise would be if housed in the console 9. Positioning theadditional dies between the proximal portion 3 of the device 1 and thepackage 10 can therefore improve the signal quality of the sensedposition data while maintaining the desired temperature.

FIGS. 8-9 illustrate another embodiment of a device 1 having a package10 with a plurality of integrated device dies 13, 12 angled relative toone another by a fixed angle. Unless otherwise noted, components ofFIGS. 8-9 are the same as or generally similar to like-numberedcomponents shown in FIGS. 1-7. FIG. 8 is a schematic front view of anintegrated device package 10 having a substrate 15 and integrated devicedies 13, 12, mounted thereto. As with the embodiment of FIGS. 1-7, thesubstrate 15 can be mounted to a bracket assembly 14. However, unlikethe embodiment of FIGS. 1-7, the bracket assembly 14 may comprisemultiple brackets 14 a, 14 b that are separated and spaced from oneanother, e.g., the bracket assembly 14 may omit the transverse portion18 shown, e.g., in FIG. 4. FIG. 9 is schematic rear view of theintegrated device package 10 of FIG. 8.

In FIGS. 8 and 9, the integrated device package 10 has separatedbrackets 14 a, 14 b that define the bracket assembly 14. The brackets 14a, 14 b depicted in FIGS. 8 and 9 are separate from and spaced from eachother along the longitudinal axis x. The bracket 14 a has a firstsupport surface 19 and the bracket 14 b has a second support surface 20.The substrate 15 can include a first portion 26 and a second portion 27,the first portion 26 mechanically connected to the first support surface19 and the second portion 27 mechanically connected to the secondsupport surface 20. For example, the first and second portions 26, 27can be adhered or bonded to the first and second support surfaces 19,20, respectively, by way of an adhesive. The first integrated device die13 can be mounted to the first portion 26 of the package substrate 15.The second integrated device die 12 can be mounted to the second portion27 of the package substrate 15. In some embodiments, the bracketassembly 14 can have more than two brackets 14 a, 14 b. While shown forpurposes of illustration with ends of the two brackets 14 a, 14 bprotruding out of the elongate body 2, it will be understood that in usethe entire package 10 can be within the elongate element 2.

As shown in FIGS. 8 and 9, similar to the embodiment of FIGS. 1-7, thesubstrate 15 can comprise a twisted section 17. The twisted section 17can be disposed between the first portion 26 and the second portion 27of the substrate 15 and be twisted about the longitudinal axis so as toposition the first and second portions 26, 27 at a fixed non-parallelangle relative to one another. The twisted section 17 may also bedisposed between the brackets 14 a, 14 b to connect the brackets 14 a,14 b. However, unlike the embodiment of FIGS. 1-7, the twisted section17 may not be connected to a corresponding twisted or transverse portionof the bracket assembly 14. Unlike the embodiment of FIGS. 1-7, in whichthe twisted section 17 can couple with the transverse portion 18, thetwisted section 17 of FIGS. 8-9 may be unconnected to the bracketassembly 14 since the bracket assembly 14 may not include the transverseportion 18.

The bracket assembly 14 having the brackets 14 a, 14 b can provide astiff support structure to support the integrated device dies 13, 12. Insome embodiments, the fixed angle between the dies 13, 12 can beprovided by applying a molding material 32 over the dies 13, 12. Themolding material 32 can be disposed entirely or partially around thepackage 10 to define the fixed non-parallel angle and/or protect thecomponents from fluids and other materials during use. In someembodiments, the mold 32 may entirely envelope the twisted section 17,and only partially envelope the brackets 14 a, 14 b. As previouslydiscussed, the fixed non-parallel angle can be about 90° in somearrangements, e.g., in a range from 89° to 91°, or in a range from 89.5°to 90.5°. However, as also explained above, in other embodiments, thefixed non-parallel angle can comprise other numerical values.

Embodiments of the package 10 with the bracket assembly 14 that do notinclude the transverse portion 18 of FIGS. 1-7 can be beneficial becausethe overall size of the package 10 of FIGS. 8-9 can be smaller than theoverall size of the package 10 of FIGS. 1-7 that includes the transverseportion 18. Referring back to FIGS. 6 and 7, the first and secondsupport surfaces 19, 20 of the bracket assembly 14 form an L-shape. Insuch embodiments deforming (e.g., twisting) the substrate 15 and/or thedies 13, 12 depends on the shape and dimensions of the bracket assembly14. However, by omitting the transverse portion 18, the package 10 maybe deformed more freely at the twisted section 17 of the substrate 15and would not be limited to the L-shape. Thus, the width W of themolding material 32 for the package 10 after deformation can begenerally similar to the width W before deformation, which canbeneficially enable the package 10 to fit within the elongate body 2.

FIG. 10 is a top perspective view of the integrated device packages 10coupled with a frame 33 during a process for manufacturing the package10, according to the embodiments of FIGS. 1-9. FIG. 11 is an enlargedview of an exemplary integrated device package 10 of FIG. 10 coupledwith portions of the frame 33. The frame 33 may comprise a metal frameor any suitable frame to assist in simultaneously manufacturing numerouspackages. In some embodiments, one or multiple substrates 15 can beplaced on bracket assembly 14, corresponding to portions of the frame33. In some embodiments, such as the embodiment of FIGS. 1-7, thebracket assembly 14 can include a transverse portion 18 disposed betweenand connecting the first and second support surfaces 19, 20. However, asexplained above, the transverse section 18 may be omitted and havebrackets 14 a and 14 b as shown in FIGS. 8-9. When there is notransverse portion 18, the bracket assembly 14 can, for example,comprise brackets 14 a, 14 b separated from and/or spaced from eachother along the axis x. The integrated device packages 10 can beseparated from the frame 33 by punching, sawing, laser cutting or anyother suitable methods of dividing the frame 33.

FIGS. 12-15 illustrate another embodiment of a device having anintegrated device package 10 with dies 13, 12 that are angled relativeto one another by a fixed non-parallel angle. Unlike the embodiments ofFIGS. 1-11, in which the substrate 15 is coupled to a bracket assembly14, in FIGS. 12-15, the package 10 may not include a bracket assembly14. FIG. 12 is a schematic front perspective view of the integrateddevice package 10 partially surrounded by the molding material 32,according to various embodiments. FIG. 13 is a schematic end view of theintegrated device package 10 with molding material 32 surrounding thepackage 10, as viewed along the longitudinal axis x of the package 10. Athird integrated device die 28 (which may comprise an ApplicationSpecific Integrated Circuit, or ASIC) may be mounted to the substrate 15proximal the dies 13, 12, and may electrically connect to the dies 13,12 through the substrate 15.

In the embodiment of FIG. 12, the package 10 is shown inside variousportions of the molding material 32. As shown, the molding material 32may be applied separately around the device dies 13, 12, and the thirddie 28. Thus, a first portion of the molding material 32 may be appliedover both dies 13, 12, and a second portion of the molding material maybe applied over the third die 28. In the illustrated embodiment, themolding material 32 may not be applied around a section 30 of thesubstrate 15 which can beneficially improve the flexibility of thepackage 10. Thus, in the illustrated embodiment, the uncovered section30 of the substrate 15 can enable the package 10 to traverse curved ornon-linear sections of the anatomy. However, in other embodiments, themolding material 32 may be applied around the section 30 such that themolding material 32 is disposed about the entire package 10.

The embodiment shown in FIG. 12, which is generally similar to theembodiments shown and described in FIGS. 3-7, can comprise the substrate15 with leads 16, and the first and second integrated device dies 13, 12can be mechanically and electrically connected to the substrate 15. Theembodiment in FIG. 12 further includes the third integrated device die28 (such as a processor die, an amplifier, a filter, ananalog-to-digital converter (ADC), etc.) mounted to the substrate 15along the first or second portions 26, 27. The third integrated devicedie 28 can process signals transmitted from the first and second dies13, 12. For example, in some embodiments, the device dies 13, 12 can bemagnetoresistance sensors such as AMR, GMR, or TMR sensor dies and thethird device die 28 can be an ADC. By angling the dies 13, 12 relativeto one another about the longitudinal axis x of the package 10, thethree-dimensional position of the package 10 can be calculated. In suchembodiments, the dies 13, 12 can transmit the sensed data signal to thethird die 28 (e.g. an ADC) for converting the sensed analog signal to adigital signal. The processed signal from the third die 28 can be sentvia the plurality of conductive leads 16 and a cable or otherinterconnects to the console 9. By processing the signals very close tothe sensors, degradation of the signals through transmission losses canbe avoided.

As explained above, the package 10 in FIGS. 12 and 13 does not includethe bracket assembly 14, as shown in embodiments in FIGS. 3-7, or theassembly without the transverse portion 18 (i.e., the brackets 14 a, 14b), as shown in embodiments in FIGS. 8 and 9. Rather, in FIGS. 12-13,the dies 13, 12 are mounted to the substrate 15, and a molding material32 is disposed about portions of the dies 13, 12 and the substrate 15 tofix the dies 13, 12 at the fixed non-parallel angle. Thus, unlike theembodiment shown in FIGS. 1-7, the molding compound 32, rather than abracket assembly 14 or other structure, effects or defines the fixednon-parallel angle between the dies 13, 12. In addition, the thirdintegrated device die 28 can be spaced from the first integrated devicedie 12 by the section 30 of the substrate 15 along the longitudinal axisx. The section 30 of the substrate 15 shown in FIG. 12 is substantiallyflat. However, it should be understood that the section 30 may form anyshape. In some embodiments, the section 30 can be fixed by applying themolding material 32. In the illustrated embodiment of FIG. 12, a lengthof the package 10 along the longitudinal axis can be in a range of 7 mmto 11 mm, in a range of 7 mm to 10 mm, or in a range of 8 mm to 10 mm.

The molding material 32 can be applied over portions of the dies 13, 12,28 and the substrate 15. In some embodiments, the molding material 32can be disposed entirely around the package 10. In some otherembodiments, the molding material 32 can be disposed partially aroundthe package 10. For example, in the embodiment of FIGS. 12-13, a firstportion of the molding material can be disposed over the first die 13,the second die 12, and the intervening twisted section 17 of thesubstrate 15. In some embodiments the molding material 32 can bedisposed only over the twisted section 17. In some embodiments, themolding material 32 can be disposed over the twisted section 17 and oneor more of the dies 13, 12, 28. Thus, the molding material 32 can bedisposed over any portion of the package 10 so as to define or maintainthe fixed non-parallel angle and/or protect the first die 13, the seconddie 12 and/or the third die 28.

FIG. 14 is a schematic top-down plan view of the package 10 with anoffset before forming the fixed non-parallel angle, e.g., beforetwisting the dies 13, 12 relative to one another. FIG. 15 is a schematicend view of the device package 10 of FIG. 14 overlaid within the lumen11 of the body 2. In FIG. 15, the molding compound is omitted for easeof illustration. FIG. 15 therefore illustrates a schematic rendering ofhow, prior to twisting the substrate 15, the package 10 is wider thanthe lumen 11 of the elongate body 2 (e.g., the catheter). As shown inFIGS. 14 and 15, the substrate 15 is shifted or laterally offset at thetwisted section 17 so as to make the integrated dies 12, 13 offset alonga transverse axis y to create a lateral offset δ between the dies 13, 12before twisting. The lateral offset δ between the dies 13, 12 allows thedies 13, 12 to fit within the diameter d of the elongate body 2 aftertwisting. Thus, the offset δ can be selected such that, after twistingthe substrate 15 to define the twisted section 17, the dies 13, 12 andsubstrate 15 can fit within the diameter d of the elongate body 2,despite the fact that it could not fit prior to twisting. The offset δcan typically be determined by sizes of the substrate 15 and othercomponents of the package 10 along the transverse axis, but otherfactors may affect the determination of the offset δ. The offset δ canbe in a range of 10 microns to 200 microns, in a range of 20 microns to150 microns, or in a range of 40 microns to 100 microns.

The package 10 can be manufactured by mounting the first and secondintegrated device dies 13, 12 on the substrate 15. The dies 13, 12 canbe spaced apart from each other along the longitudinal axis x, and alongthe transverse axis x by an offset δ. The substrate 15 can be deformed(e.g., twisted) so as to angle the dies 13, 12 relative to one anotherabout the longitudinal axis x by the fixed non-parallel angle (about 90°in some arrangements, e.g., in a range from 89° to 91°, or in a rangefrom 89.5° to 90.5°). The molding material 32 can be applied to thepackage 10 to fix the fixed non-parallel angle (in the absence of abracket assembly or another structure that fixes the angle) and/or toprotect the dies 13, 12, 28 at a molding step.

The first and second integrated device dies 13, 12 can be electricallyconnected to the substrate 15. For example, the dies 13, 12 may be flipchip mounted to the substrate 15 by way of a plurality of solder balls.For another example, the dies 13, 12 can be wire bonded to the substrate15 using conductive bonding wires. In some embodiments, the third die 28can also be mounted on and electrically connected to the substrate 15.In some embodiments, the deforming step can include offsetting thesubstrate 15 in the transverse axis y, twisting the substrate 15, and/oradhering the substrate 15 to the bracket assembly 14.

FIG. 16 is a schematic front perspective view of an integrated devicepackage 10, according to another embodiment. In FIG. 16, as with theembodiments described above, the package 10 can include first and secondintegrated device dies 13, 12 (which may comprise motion sensor dies asexplained above), a third integrated device die 28 (which can comprise aprocessor die or ASIC configured to process signals transduced by thedies 13, 12) with the dies 13, 12, 28 at least partially surrounded by amolding material 32. As with the embodiment of FIG. 12, the moldingmaterial 32 can be the structure that maintains the fixed non-parallelangle between the dies 13, 12. The package 10 of FIG. 16 is generallysimilar to the package 10 illustrated in FIG. 12. However, unlike thethird integrated device die 28 of FIG. 12, the third integrated devicedie 28 of FIG. 16 can be stacked over the second die 12. Further, theembodiment shown in FIG. 16 includes a bracket assembly 14, although inother embodiments, the package 10 of FIG. 16 may not include anybrackets or other structures that separately support or stiffen the dies13, 12, 28. For example, as shown in FIG. 16, a first bracket 14 a canbe connected to the first die 13 and the opposite side of the portion ofthe substrate 15 to which the die 13 is mounted, such that the first die13 and the substrate 15 are disposed between the first brackets.

In addition, as shown in FIG. 16, one or more passive components 35(such as a capacitor) may be mounted to and electrically connected tothe substrate 15 adjacent the second and third dies 12, 28. The passivecomponent(s) 35 can be configured to smooth signals prior to or afterprocessing by the third die 28. In various embodiments, it may bedesirable to dimension the passive component 35 sufficiently small suchthat the entire sizing of the package 10 is not affected by thedimension of the passive component 35. For example, the dimension of thepassive component 35 can be less than 0.3 mm along the transverse axis,less than 0.5 mm along the longitudinal axis and less than 0.3 mm inheight.

The third integrated device die 28 (for example, a processor die orASIC) can be electrically connected to the substrate by any suitablemethod, e.g., by way of solder balls 55). As shown in FIG. 16, forexample, the solder balls 55 can provide vertical standoff of the thirddie 28 relative to the substrate 15, e.g., to provide clearance or acavity sufficiently sized to receive the second die 12 between the thirddie 28 and the substrate 15. In some embodiments, the third die 28 cancontact the second die 12, but in other embodiments, the third die 28can be vertically spaced above the second die 12, e.g., the solder balls55 can space the third die 28 above the second die 12 in someembodiments. In other embodiments, the third integrated device die 28may be, for example, wire bonded to the substrate 15.

Stacking the third integrated device die 28 over the second integrateddevice die 12 can advantageously shorten the length of the package alongthe longitudinal axis x, as compared with the embodiments of FIG. 12,since the second and third dies 12, 28 can be positioned at about thesame longitudinal position along the elongate body 2. In the illustratedembodiment of FIG. 12, a length of the package 10 along the longitudinalaxis can be in a range of 3 mm to 6 mm, in a range of 3.5 mm to 5.5 mm,in a range of 3.5 mm to 5 mm, in a range of 4 mm to 5.5 mm, or in arange of 4 mm to 5 mm, e.g., about 4.5 mm in one embodiment.

Stacking the third integrated device die 28 over the second integrateddevice die 12 can also advantageously reduce a total length of tracesembedded in the substrate 15 by making the substrate 15 more compact ascompared with the embodiment of FIG. 12.

The bracket assembly 14 can be used for twisting the substrate 15, forprotecting the dies 13, 12, 28, and/or for supporting the dies 13, 12,28 and substrate 15 during molding. In the illustrated embodiment, thefinal package 10 can include the bracket assembly 14. In otherembodiment, the bracket assembly 14 can be eliminated in a finalproduct.

FIG. 17 is a schematic back perspective view of the integrated devicepackage 10 of FIG. 16. The package 10 as illustrated in FIG. 17 hasconductive leads 16 on the substrate 15. The number of the conductiveleads 16 shown is six, however, there can be any suitable number ofconductive leads 16.

FIG. 18 is a schematic end view of the integrated device package 10 ofFIGS. 16 and 17, as viewed along the longitudinal axis x of the package.As explained with respect to the embodiment shown in FIG. 6, the moldingmaterial 32 that surrounds the package 10 can have a height H (asmeasured from a flat surface of the octagonal shape to an opposing flatsurface as shown in FIG. 18) along a transverse axis that isperpendicular to the longitudinal axis x. In some embodiments, theheight H can be around 450 microns: The height H can be in a range of300 microns to 600 microns, in a range of 300 microns to 550 microns, ina range of 350 microns to 550 microns, in a range of 350 microns to 500microns, in a range of 400 microns to 550 microns, or in a range of 400microns to 500 microns. In the embodiment shown in FIG. 18, portions ofthe molding material 32 (which may originally have a circular profile)can be trimmed to form an octagonal shape, which can beneficially reducethe overall lateral dimensions of the package 10 and to improve the fitof the package 10 within the elongate body 2. The width W for theembodiment illustrated in FIG. 18 can be generally similar to the widthW for the embodiment illustrated in FIG. 6. In the embodimentillustrated in FIG. 18, the width W can be a dimension measured from avertex to another vertex farthest from the vertex, e.g., the width W candefine a major lateral or transverse dimension of the package 10.

FIG. 19 is a top perspective view of the integrated device packages 10of FIGS. 16 and 17 coupled with a frame 33 during a manufacturingprocess prior to forming the twisted section 17. In each package 10, thesubstrate 15 can have a winding 37 for easily twisting the firstintegrated device die 13 relative to the second and third integrateddevice die 12, 28. It should be understood that the winding 37 can bedisposed at a different portion of the substrate 15 from what isillustrated in FIG. 19.

Although disclosed in the context of certain embodiments and examples,it will be understood by those skilled in the art that the presentinvention extends beyond the specifically disclosed embodiments to otheralternative embodiments and/or uses and obvious modifications andequivalents thereof. In addition, while several variations have beenshown and described in detail, other modifications, which are within thescope of this disclosure, will be readily apparent to those of skill inthe art based upon this disclosure. It is also contemplated that variouscombinations or sub-combinations of the specific features and aspects ofthe embodiments may be made and still fall within the scope of thepresent disclosure. It should be understood that various features andaspects of the disclosed embodiments can be combined with, orsubstituted for, one another in order to form varying modes of thedisclosed invention. Thus, it is intended that the scope of the presentinvention herein disclosed should not be limited by the particulardisclosed embodiments described above, but should be determined only bya fair reading of the aspects that follow.

What is claimed is:
 1. An integrated device package comprising: apackage substrate; a first integrated device die mounted to the packagesubstrate; a second integrated device die mounted to the packagesubstrate, the first integrated device die spaced from the secondintegrated device die along a longitudinal axis, the first and secondintegrated device dies angled relative to one another about thelongitudinal axis by a fixed non-parallel angle; and a molding materialat least partially disposed over the package substrate between the firstand second integrated device dies to maintain the fixed non-parallelangle.
 2. The package of claim 1, wherein the package substratecomprises a twisted section disposed between the first and secondintegrated device dies, the molding material disposed over at least aportion of the twisted section.
 3. The package of claim 1, wherein thepackage substrate comprises a flexible insulating sheet with embeddedconductors.
 4. The package of claim 1, wherein the first and secondintegrated device dies comprise sensor dies.
 5. The package of claim 4,wherein the first and second integrated device dies comprisemagnetoresistance sensors, the magnetoresistance sensors comprising atleast one of anisotropic magnetoresistance (AMR) sensors, tunnelingmagnetoresistance (TMR) sensors, and giant magnetoresistance (GMR)sensors.
 6. The package of claim 5, wherein the first integrated devicedie is configured to sense a position of the package along first andsecond orthogonal axes, and wherein the second integrated device die isconfigured to sense the position of the package along a third axisorthogonal to the first and second axes.
 7. The package of claim 5,further comprising a third integrated device die mounted to the packagesubstrate, the third integrated device die configured to processposition data transduced by the first and second integrated device dies.8. The package of claim 7, wherein the third integrated device die is ananalog-to-digital converter (ADC).
 9. The package of claim 7, whereinthe third integrated device die is stacked over the second integrateddevice die.
 10. The package of claim 1, wherein one or more of the firstand second integrated device dies is flip chip mounted or wire bonded tothe package substrate.
 11. The package of claim 1, wherein a length ofthe integrated device package along the longitudinal axis is in a rangeof 3 mm to 15 mm, and the package has a width along a transverse axisthat is perpendicular to the longitudinal axis, the width being in arange of 50 microns to 600 microns.
 12. The package of claim 1, whereinthe fixed non-parallel angle is formed by a twisted section of thepackage substrate, and the fixed non-parallel angle is in a range of 89°to 91°.
 13. The package of claim 1, further comprising a bracketassembly extending along a longitudinal axis configured to providestiffness for the first and second integrated device dies.
 14. Anintegrated device package comprising: a package substrate; a firstintegrated device die mounted to the package substrate; a secondintegrated device die mounted to the package substrate, the firstintegrated device die spaced from the second integrated device die alonga longitudinal axis, the first and second integrated device dies angledrelative to one another about the longitudinal axis by a fixednon-parallel angle, wherein the integrated device package has a widthalong a transverse axis that is perpendicular to the longitudinal axis,the width being in a range of 50 microns to 600 microns.
 15. The packageof claim 14, further comprising a molding material that fixes the fixednon-parallel angle.
 16. The package of claim 14, wherein the first andsecond integrated device dies comprise sensor dies.
 17. A medical devicecomprising: an elongate body having a proximal portion and a distalportion spaced from the proximal portion along a longitudinal axis; andan integrated device package coupled with the elongate body, theintegrated device package comprising a first integrated device die and asecond integrated device die spaced from the first integrated device diealong the longitudinal axis, wherein the integrated device package has awidth along a transverse axis that is perpendicular to the longitudinalaxis, the width being in a range of 50 microns to 600 microns, andwherein the first and second integrated device dies are angled relativeto one another about the longitudinal axis by a fixed non-parallelangle.
 18. The medical device of claim 17, wherein the elongate bodycomprises a catheter, the integrated device package disposed in a lumenof the catheter.
 19. The medical device of claim 17, further comprisinga cable extending proximally from the integrated device package alongthe elongate body, the cable electrically connected to leads of theintegrated device package.
 20. The medical device of claim 17, furthercomprising a controller in electrical communication with the integrateddevice package, the integrated device package configured to transmit asignal to the controller indicative of a position of the integrateddevice package.